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Elite Hardware Engineer Accelerator

The course is a self-study series of training videos that guide you to become a professional hardware and PCB designer using the unique MESH method created by Kirsch Mackey. You will master the design of high-speed PCBs, expertly navigating Signal Integrity (SI), Power Integrity (PI), Electromagnetic Compatibility (EMC), and Electromagnetic Interference (EMI) constraints.
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Elite Hardware Engineer (Pillars 1-6)

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Video lectures, Documents, 6 Projects

120 Hours

Email, and Portal message support

Unlimited Emails and Discussion Threads

Step-by-Step Checklist and Roadmap

10-Step System to Go from Zero to designing industry level designs. Knowing what designs are made and why and never having self doubt again about designing PCBs from scratch that actually work!

Group Classes

Weekly group classes to take you through the curriculum, keep you accountable, keep pace and answer questions.

What's included?

  • 10 Chapters
  • 1 Certification
  • 8 Projects
  • 125+ Videos
  • 10+ PDFs and Docs

Become a Hardware Engineer

You will learn how to design printed circuit boards operating at low speeds and high speeds (10 Gbps) through study, theory and application

New Career + New Status + More money

Self-Start a new career in Hardware and PCB design within 90 days, and in advanced Hardware and PCB design in 90 days.
Overview

Here is what we will cover in
this course

The MESH Method to PCB Design

The fastest method to holistically understanding PCB design from low speed to high speed

Schematic Capture

Learn Schematic Capture and Principles Across multiple different PCBs. Learn practical tips or capture that take interdisciplinary teams into consideration.

PCB Layout

Place your components optimally for manufacturing, signal integrity, EMI, PI and high-speed digital design

Understand and plan for communication Protocols

Design a PCB for interfaces like PCIe, MIPI, I2C, SPI, UART, USB, Ethernet, etc.

Gain Embedded Mobile Experience

Design boards for mobile and/or embedded processors and memory systems

Professional Software

Learn OrCAD (Eventually Altium, OrCAD X, CircuiMaker, Allegro DE HDL, etc.)
Transform your engineering journey with HaSofu's groundbreaking 120-hour training program. Master the art of hardware and PCB design, and say goodbye to expensive outsourcing. Our curriculum, designed by the esteemed Kirsch Mackey, incorporates one-on-one coaching, hands-on project experience, and a deep dive into industry standards like IPC-2221 and apply Signal Integrity, Power Integrity, EMI. In just 12 weeks, you'll conquer design challenges, select components with confidence, and ensure your designs work the first time. Elevate your skills and become indispensable in the competitive world of electrical engineering. Your journey to design mastery starts now with HaSofu.

Course Curriculum

We will help you unlock your inner potential so you can excel in your professional field. Some of the benefits of our trainings are:
  • Foundations of PCB Design - Build your first 2-layer PCB from start to finish
  • (M)anufacturing and Excellence in Design - Build your second 2-layer PCB from schematic to PCB based on IPC-2221 and our proprietary PCB design processes
  • (E)lectromagnetism (EMI, EMC, ESD) - Learn the foundations of Electromagnetism from an intuitive approach to PCB design
  • (S)ignal Integrity Essentials - Learn all root problems of signal integrity and how to remove them for good - Build a 10-layer board
  • (H)igh-Speed Digital Design - Learn high-speed digital design and Build your first high-speed practical PCB at 10 Gbps - xnets, diffpairs, tuning, length matching, etc.
  • Power Integrity (PI) - Power Distribution Network Design - Bring it all together by designing a power electronic board and reduce impedance profile
  • Component Selection - Understand the component selection process from start to finish so you know how to go from concept to completion
  • Communication Protocols - Learn how the components interact and design for signal integrity, impedance control, stack-up materials and how they all affect PCB layout for high-speed boards
  • Advanced PCB Layout and Integration - Complete the intermediate/advanced capstone project for this course - DDR3, HDMI, Ethernet, BGA fanouts, etc.
  • Career Launch - Learn how to update your resume and LinkedIn the modern way so you attract the jobs you want instead of hunting for the jobs you can get right now.

Detailed Curriculum

In this course, you'll understand and master the foundations of all printed circuit board design, enabling you to operate independently as a designer and assist senior to entry-level designers with most PCB design and layout tasks regularly.

LEARNING AND PERFORMANCE OBJECTIVES:
Our program is designed to provide circuit board designers with a balanced foundation of theoretical knowledge and practical skills in PCB design and hardware design, including part selection.

Upon completion, participants will be able to:
  • Define and create DRC rules to IPC standards
  • Create Rigid boards to multiple IPC classes
  • Implement industry best practices for reliable, manufacturable, and cost-effective PCBs
  • Understand the trade-offs between layout techniques and when to use them
  • Create PCB footprints, schematics, layouts, multilayered impedance-control stack-ups
  • Generate manufacturing files, documentation, silk screen markings, and pre- and post-analysis design reviews of their designs

Course Content:
MODULE 1: INTRODUCTION (Reading Requirements)
  • Learn about Design for Manufacturing, Signal Integrity, Electromagnetic Interference, and High-Speed Digital Design
  • Understand the PCB designer’s journey on the job
  • Assigned Reading to Understand the full PCB Design process (116 pages)
  • Assignment 1 – Understanding PCB design experience in the industry

MODULE 2: PROJECT 1 – DESIGN A PCB IN 2 HOURS TO UNDERSTAND PCB DESIGN SOFTWARE
  • Create a Schematic
  • Netlisting and PCB creation
  • PCB Overview, Stack-up and Setup, Creation
  • Component Placement, Design Rules, Part Placement, Routing, Routing Clean-up
  • Manufacturing Preparation, Creating Design Outputs for Manufacturing – Gerber & Drill
  • Design Review
  • Quiz 1 – Software navigation, process, procedure
  • Understand manufacturing, stack-up, high-speed concepts, and standards

MODULE 3: DESIGN FOR MANUFACTURING – PROJECT 2 SCHEMATIC CAPTURE
  • Learn the HaSofu Academy Kirsch Mackey’s METT Method and MESHPi Design Process
  • The Design for Excellence Process (Manufacturing, Fabrication, Assembly & Test)
  • Create Block Diagrams, Schematic Creation for USB Circuit, Power and LEDs, Processor
  • Wiring the Power Circuit, LEDs, USB, and Processor
  • Schematic checks, Design rules checks, Bill of Materials, PDF Creation

DESIGN FOR Excellence (DFx) – PROJECT 2 PCB LAYOUT
  • PCB Stack-up from the Manufacturer, PCB Board Outline from DXF Import & Mounting Hole Creation
  • Apply Fabrication Design Rules, Shortcuts for improved PCB design efficiency
  • Understand Return Paths in Mixed-signal PCB design (Signal Integrity)
  • Component placement, Design Sync (Engineering Change Orders)
  • Creating Design for Assembly Rules, Collision Detection and Visualization
  • Manufacturing Test Points, Routing and Copper Pour for Ground and Power, Mixed Signal Layout
  • Differential pair routing, Design rules check, 3D MCAD Model Exports
  • Packaging and sending Manufacturing Deliverables
  • Final project submission

MODULE 6: MULTILAYER PCB, SI & EMI + Schematic Design Reuse – PROJECT 3 SCHEMATIC CAPTURE
  • Understand the nine key signal integrity issues and how to overcome them
  • Plan a schematic for improved design efficiency, simulate circuits, tackle part obsolescence, and reuse older designs
  • Circuit SPICE simulation for analog, digital analysis
  • Advanced block diagram layout + floor planning for PCB
  • Part organization, time efficiency, Net names / aliases, Design rules check
  • Bill of Materials, PCB Trace Current Carrying capacity calculation, PCB Trace voltage withstanding clearance

MODULE 7: MULTILAYER STACK-UP ANALYSIS FOR SIGNAL INTEGRITY AND EMI (PROJECT 3 PCB LAYOUT)
  • Learn to design with signal integrity and EMI considerations embedded into design habits
Analysis of 4-layer, 6-layer, 8-layer, and 10-layer PCB stack-ups
  • Assignments to assess all the layer types, project-specific stack-up for Dual Rail Power Supply Design (10 layers)

MODULE 8: MULTILAYER DESIGN FOR SI, EMI, EMIC – PROJECT 3 CONTINUED
  • Solve each of the signal integrity and EMI problems while building a design
  • Mounting Holes, Part Placement, Custom Colors, Exporting Design constraints, Blind and Buried VIAs setup
  • Analog Routing, Fixing DRC and pad stack errors, Fixing Signal Reflections, Crosstalk, VIA Stubs, Skew, Signal Attenuation, Ground Bounce
  • Power Distribution Network, Introduction to High-Speed Digital Design
  • Power, Ground, Critical Net, and Length Matching routing
Grounding shield, analog and mains through shorting bars, Avoiding ground loops
  • Fabrication Files, Assembly Files, Project submission & Review

MODULE 9: INTRODUCTION TO HIGH-SPEED DIGITAL DESIGN - USB-C PROJECT
  • Introduction to HSDD concepts - Sierra Circuits HSDD guide
  • Part Selection, Materials for high-speed board stack-up
Design a USB A to USB C converter for USB 3.2 Gen 1 (5 Gbps) from scratch
  • Simulate the high-speed digital design response, Learn Length and phase tuning, propagation and speed delay, eye diagrams, signal reflection analysis, differential pair routing, return vias, fanouts, layer constraints

MODULE 10: HIGH-SPEED DIGITAL DESIGN – SCHEMATIC & PCB LAYOUT
  • Design a 6-layer single Board computer with Sitara M Processor ARM based process, DDR3 SRAM
  • Creating Net classes, BGA package fanout and routing, eMMCs, UART, MIPI, PCIe I2C, I2S
  • Advanced Differential pair routing, Apply all tasks mentioned in prior projects
  • Thorough understanding of PCB design with repeated experience with professional engineering software tools

MODULE 11: POWER ELECTRONICS
  • Complete all schematic and PCB Layout and documentation tasks similar to Project 4, but for power electronics
  • Understand power integrity, complete the 140+ step checklist to get a design right the first time
  • Content review, submission of final project, and final exam
  • Complete final design project package and documentation
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